Yole Développement presents its latest 3D TSV market trends analysis at the Asia Technology Forum
News Release from:
Yole Développement
22 October 2012
Yole Développement supports the Asia Technology Forum powered by SUSS MicroTec. Yole Développement's Taiwan CTO, Pascal Viaud moderates this event and presents the latest analysis in the field of Advanced Packaging. Visit the SUSS MicroTec website here to register.
Next month, SUSS MicroTec invites you to the Asia Technology Forum covering the latest in materials, manufacturing technologies and market trends in 3DIC and Wafer Level Packaging. The SUSS Asia Technology Forum will be held on three separate dates at three convenient locations:
-Singapore on Nov. 15, 2012
-Hsinchu, Taiwan on Nov. 20, 2012
-Shanghai, China on Nov. 22, 2012
SUSS MicroTec’s forum features speakers from industry leading companies and world-renowned research institutions.
Yole Développement moderates this event and presents its latest analysis on 3D TSV technologies and market trends. 3D TSV and other mid-end processing technologies have become a strategic area to step in for many global players. In particular in Asia, wafer foundries and OSAT's recent interest and investments are paving the path to major growth opportunities (10x faster than the global semiconductors industry). 2013 is expected to be the key turning point for the true 3DIC technology implementation in significant volume,” explains Pascal Viaud, Chief Technology Officer, Yole Développement, Taiwan.
List of speakers: Brewer Science, Fraunhofer IZM Berlin, GenISys, HD MicroSystems, Industrial Technology Research Institute, PVA TePla, Shanghai Institute of Microsystem and Information Technology, STATS ChipPAC, SUSS MicroTec and Yole Développement.
