Laird Technologies to Attend 2012 IEEE International Symposium on Electromagnetic Capability
News Release from:
18 July 2012
Laird Technologies today announced it will be attending the 2012 IEEE International Symposium on Electromagnetic Capability. The event will take place at the David L. Lawrence Convention Center in Pittsburgh, Pennsylvania, August 5-10, 2012. Laird Technologies will be located at booth #822.
Laird Technologies will be exhibiting a number of EMI solutions that address changing issues in the EMC field, such as higher cycling, packing densities and environmental treads.
The company will showcase elastomers and Fabric-over-Foam solutions including EcoShear and hybrid tape products. Laird Technologies will also showcase new board-level shielding solutions, such as the ReMovl product enhancement and the Rigid Corner Board Level Shield Enhancement.
The 2012 IEEE International Symposium on Electromagnetic Capability is sponsored by the IEEE Electromagnetic Compatibility Society. The program features technical sessions, tutorials and networking events as well as an exhibit hall with hundreds of booths featuring the latest products and services in the EMC field.
As an industry-leading EMI solutions provider, Laird Technologies provides solutions with every available material and form factor. The Company’s engineers and scientists constantly invent and perfect new materials, processes and products to solve EMI problems. To learn more about these solutions from industry-leading technical experts in person, visit the Laird Technologies booth.