ISTFA 2011, Bond Testing and Inspection

Nordson DAGE to Exhibit Bond Testing and Inspection at ISTFA 2011

News Release from: Nordson DAGE
14 October 2011

Nordson DAGE will highlight its latest bond testing and X-ray inspection capabilities in Booth #326 at the upcoming International Symposium for Testing and Failure Analysis (ISTFA), scheduled to take place November 15-16, 2011 at the McEnery Convention Center in San Jose, CA.

The 4000Plus Bondtester represents the new industry standard in bond testing with unsurpassed data accuracy and repeatability. Nordson DAGE bond test technology meets the requirements of emerging test applications including ribbon pull, pad cratering using hot pin pull, bend and fatigue testing. The 4000Plus bondtester uses the next-generation Paragon™ software providing semi-automatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting.

Also featured at the show will be the Nordson DAGE μCT Inspection Option, which provides Computerised Tomography (CT) functionality to compliment the 2-D X-ray investigations on Nordson DAGE X-ray inspection systems. It uses the superior, sub-micron feature recognition of 2-D X-ray images that Nordson DAGE X-ray systems always provide to produce the best CT models for 3-D sample analysis, virtual micro-sectioning and internal dimensional measurements. Additionally, the option reduces the number of time-consuming micro-section analyses needed, assisting in identifying where micro-section preparation and investigation must concentrate. The μCT inspection capability is available with a system order or as retro-fit to suit application and workflow needs.