Force Technologies Ltd and Global Circuit Innovations Inc. announce strategic partnership to deliver next generation circuit solutions for combating semiconductor counterfeitingand a resolution to DMSMS.
News Release from:
Force Technologies Ltd
27 October 2011
Adding to our extensive solution base for DMSMS and counterfeiting; Force Technologies can now offer a qualified method of reclaiming die from COTS plastic packages and assembling them into new, ceramic/Hermetic packaging. Now it's possible to offer high levels of qualification to the process of: Die reclamation, Re-assembly, Re-test and upscreening of many device types, EOL, obsolete and IC's previously not available for prototyping, Military, Space and Deep Well applications.
“Mike Salmon and Force Technologies are demonstrated leaders in critical operating environments that require advanced technology solutions and engineering. At Global Circuit Innovations we are pleased to form a strategic partnership with Force Technologies. We believe that our research and innovations in advanced circuit solutions will be a strong fit with the Force portfolio of leading technology services. We look forward to successfully delivering technology innovation across the EMEA region in the years ahead.”
- Erick Spory, President and CTO, GCI Inc.
Reclamation is available from 1 to 15,000 units/month. Specification screening from Commercial to Mil-Std-883 M5004 with options for: Group Testing, HAST and FA.
