Toshiba Electronics to showcase advanced semiconductor solutions for automotive designs
News Release from:
Toshiba Electronics Europe
15 September 2010
At Electronica 2010 Toshiba Electronics Europe (TEE) will be showcasing a selection of advanced semiconductor solutions for automotive applications and presenting a paper on new microcontroller technologies for automotive safety systems.
Visitors to the Toshiba stand in the Hall 6 automotive sector will have the opportunity to see the latest ‘Capricorn’ system-on-chip (SoC) solutions for driving and managing high-quality automotive displays; new ARM Cortex™-M3 microcontroller technologies that address ISO26262 ASIL ( Automotive Safety Integrity Level) requirements for safety-critical systems; and automotive-qualified ASSP (application specific standard products) driver ICs that simplify the implementation of brushless DC (BLDC) motor control. The company will also be unveiling a new BiCDMOS semiconductor process platform for next-generation automotive ICs and showcasing automotive LEDs and power MOSFETs.
Capricorn display processors are highly integrated, scalable SoCs targeted at automotive digital instrument clusters and head up display (HUD) applications. Among the Capricorn SoCs on show at Electronica will be Capricorn-F, the first member of the family to provide support for 3D graphics and to incorporate APIX® Gigabit digital serial data link transmission.
Designed to address the requirements of IEC61508 SIL3 and ISO26262 ASILD, Toshiba’s latest ARM Cortex-M3 32-bit microcontrollers incorporate Yogitech’s faultRobust technology. Compared to a conventional dual-core lockstep concept this reduces hardware and software overhead, while implementation of hardware diagnostic circuits with built-in self test allows transient and latent faults to be recognized. Using such a fault-tolerant MCU concept can also support development of fail-safe or fail-operational automotive systems. This technology will form the basis of Toshiba’s presentation for the Electronica Automotive Forum (Hall A6, stand 530) on 11th November at 15.00.
Among the ASSPs on show for the first time will be controller/pre-driver ICs optimised for driving the power stage of an automotive motor application while meeting the stringent requirements of the AEC-Q100 and TS16949 standards. These highly integrated devices will simplify and reduce the cost of implementing BLDC motors in applications such as fans, pumps and compressors.
For OEMs looking to develop their own ASICs Toshiba’s latest 130nm BiCDMOS process will permit unprecedented integration in robust, power efficient devices that need to provide reliable operation across the extended automotive temperature range.