Microsemi Patented PLAD(TM) Technology Delivers Safer Air Travel
News Release from:
11 November 2010
Microsemi Corporation (Nasdaq:MSCC), a leading provider of semiconductor technology aimed at building a secure, smart, connected world, today announced that its family of Plastic Large Area Device (PLAD)(TM) surface-mount transient voltage suppressors (TVS) enables avionics systems to meet new safety standards required for today's carbon composite-skinned aircraft.
Microsemi's PLAD TM packaging improves surge protection, preventing the disruption of digital signal processing, component damage and interruption of function due to the indirect effects of lightning. These new multiple-burst lightning-protection requirements were specified by the Radio Technical Committee for Aeronautics in the United States, and the European Civil Aviation Electronic organization.
Our end customers in the avionics market must meet the strictest standards of safety and security, said Kare Karlsen, Microsemi's Executive Vice President of its High Reliability Group. Our ability to deliver compliance is further proof of Microsemi's commitment to provide a unique advantage to customers who value power, precision, security and reliability.
Modern military aircraft, such as the F-22, use composites for at least a third of their structures, and commercial aircraft such the Boeing 787 use composite materials for nearly all exterior surfaces except for the leading edges of the wings, the stabilizers and the engine pylons. Composite-skinned airframes have less intrinsic ability than earlier aluminum airframes to keep a large lightning strike from damaging the aircraft and its on-board electronics. The company's top avionics customers have selected its TVS solutions to ensure safety and reliability in critical and essential system functions performed in the engine control equipment, ignition systems and on-board aerial cameras.
Microsemi's PLAD technology is the first to enable more effective surface-mount TVS packaging for both 15 kW and 30 kW devices. It combines a large die size with an exposed bottom contact for heat sinking that improves power handling as compared to through-hole devices, and is compatible with standard assembly automation.
Come see Microsemi TVS devices, featuring patented PLAD packaging live at Electronica 2010, Stand A4.525, at the New Munich Trade Fair in Munich, November 9-12.