KEMET Features Flex Mitigation Technology at Electronica 2010
News Release from:
11 November 2010
KEMET Corporation (NYSE Amex: KEM), a leading manufacturer of tantalum, ceramic, aluminum, film, paper and electrolytic capacitors, today announced that it will be featuring its Flex Mitigation technology this week at Electronica 2010 in Munich, Germany.
“KEMET Flex Mitigation technology has proven its worth by lowering the risk of board-flex failures,” said Dr. Phil Lessner, KEMET Vice President and Chief Technology Officer. “With our recent addition of high voltage and tin/lead termination systems for critical applications, our expanded Flex Mitigation product line reinforces KEMET’s commitment to offering the most complete line of capacitance solutions in the industry.”
KEMET Flex Mitigation technology significantly reduces ceramic chip failures due to flex cracks, the primary failure mode of multilayer ceramic capacitors (MLCCs). This technology decreases the probability of a low IR or short circuit condition when forced to failure in a board stress flex situation.
Driven by the demand for more reliable components, Flex Mitigation capacitors are designed for applications where higher operating temperatures or mechanical stress are concerns. Any application in the consumer, medical, industrial (power supply), military/aerospace and telecom markets can benefit from this technology. Additionally, all KEMET Flex Mitigation products are AEC-Q200 certified for automotive applications.
The KEMET Flex Mitigation portfolio includes Open Mode, Floating Electrode (FE-CAP), Flexible Termination (FT-CAP), Floating Electrode with Flexible Termination (FF-CAP) and KEMET Power Solutions (KPS).
To learn more about KEMET Flex Mitigation products, please visit our booth at Electronica 2010 in Hall B6, Booth 442.