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contactless payment, Texas InstrumentsTI's untra-thin chip module enables production of high-quality graphics-rich branded contactless cardsNews Release from:
Texas Instruments Texas Instruments has announced the availability of its ultra-thin module for contactless payment applications which removes another technology barrier for broader proliferation of contactless payment. Now 26 percent thinner than conventional packaged contactless chip offerings, the new ultra-thin module enables card manufacturers to produce an increasing array of colorful and distinctive products with higher yields as a result of causing fewer visual imperfections than thicker chip modules.
Banks are increasingly offering new graphics-rich contactless cards to differentiate their brand and stay “top of wallet” with consumers. Over the next few years, banks will issue more than 50 million opaque contactless cards annually with the expectation that number will double in 2010 (ABI Research). Using the new TI ultra-thin module, the industry’s thinnest contactless payment chip, card manufacturers can create thinner PVC pre-laminate sheets for the contactless layer. The 280um (11mil) ultra-thin module enables the creation of pre-laminates as thin as 345um (13.6 mil). This allows the card manufacturers to print the card’s colorful artwork on thicker print stock while maintaining the 680-840um (26.8-33.1 mil) ISO standard for card thickness. Thicker print stock makes these complex cards more durable and able to survive multiple passes through a printing press during standard card manufacturing processes, translating to higher yields of finished cards. |
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