AUTOSAR 3.0-compatible software, NEC, KPIT Cummins
NEC Electronics and KPIT Cummins Collaborate on New AUTOSAR 3.0-Compatible Solution
News Release from:
NEC Electronics (Europe) GmbH
06 October 2009
NEC Electronics Corporation and KPIT Cummins, today announced the availability of an AUTOSAR 3.0-compatible software package for various hardware platforms. This software package enables easy design of application software without the need for new developments. The package includes AUTOSAR Basic Software and a comprehensive tool chain, and was developed in close cooperation between the two companies.
An automotive supplier will receive all hardware-independent AUTOSAR basic software modules from KPIT, including the operating system (OS), memory management and communication functions for FlexRay™ systems, CAN and LIN bus systems. In addition to this, KPIT provides an intuitive user interface (UI) tool suite facilitating AUTOSAR needs in terms of ECU configuration. NEC Electronics supplies the specified AUTOSAR microcontroller abstraction layer (MCAL), which is completely optimized on hardware from NEC Electronics and acts as an interface between the Hardware-independent basic software and hardware.
We are convinced that our collaboration enables us to support our customers with innovative and efficient AUTOSAR solutions today and in the future, said Hiroaki Kaneko, general manager, Automotive Systems Division, NEC Electronics Corporation. Our customers’ satisfaction is proof of our strategy to search for new and improved features that offer robust solutions in AUTOSAR-compliant software.
We have been continuously seeking to build and offer solutions that speed up and simplify AUTOSAR integration. We expect our AUTOSAR R3.0-compatible solution to further help suppliers in making seamless transition using their well-tested legacy systems, said Anup Sable, vice president, Automotive & Allied Engineering, KPIT Cummins.
The AUTOSAR standard clearly defines the software interfaces and unifies them for all manufacturers and is continuously developed by a consortium of leading automotive manufacturers, semiconductor manufacturers and suppliers. Current versions available are Version 3.0 / 3.1.