NXP's ESD protection portfolio expanded with 15 new devices
News Release from:
NXP Semiconductors Netherlands B.V.
10 September 2012
NXP has unveiled its expanded range of circuit protection devices combining both ultra-low capacitance and ultra-low clamping voltages. With high ESD robustness exceeding IEC61000-4-2 level 4 on system level, NXP's ESD protection portfolio now includes 15 devices ideal for protecting high-speed signal lines such as HDMI, MHL, MIPI, DisplayPort, eSATA, Thunderbolt, USB 3.0/2.0 and Ethernet.
Highlights of the latest additions to NXP’s ESD protection portfolio include:
-Deep snapback combined with very low dynamic resistance. Highly sensitive to ESD pulses, the latest system-on-chips for ultra-high-speed data lines require system-level circuit protection up to 10 kV (IEC61000-4-2), as well as extra support for signal integrity. The NXP IP4294CZ10-TBR and IP4369CX4 are designed to protect even the most sensitive high-speed interfaces: They offer a unique blend of deep snapback (2.95 V typ @ 1A) and a very low dynamic resistance of only 0.4 Ohm and 0.2 Ohm, respectively. The IP4294 is already used for USB 3.0 applications by major players in the industry and offers the strongest overall SoC protection against ESD pulses. It is housed in a leadless DFN2510A-10 (SOT1176) package that is designed for pass-through routing which optimizes signal integrity and simplifies board layout. The IP4369, with only 0.8 pF (typ), provides the strongest SoC protection in the popular WLCSP4 footprint.
-Low clamping / standard breakdown devices. NXP also provides low clamping parts without snapback for universal use, including applications connected to DC current sources with high current limits, such as Vbus. These include uni- and bi-directional ESD protection devices up to 5 lines such as PESD5V0X1BCL, PESD5V0X1BCAL, PESD5V0F5UV or the PESD5V0X1U family. These devices offer best-in-class overshoot and clamping voltages (of 7.5 V after 30 ns for an 8 kV ESD pulse, in compliance with IEC61000-4-2) and ultra-low capacitance down to 0.49 pF (typ).
-Strongest protection in a tiny footprint. NXP offers package options, including very small and thin plastic SMD and WLCSP down to the 0603 form factor (DSN0603-2, 0201 inch). Other options include NXP’s innovative leadless solderable side pads package, which enables visual inspection and provides very robust soldering (DFN1006D-2). These ultra-compact packages make the NXP circuit protection portfolio especially well-suited for space-constrained applications such as smartphones, players, tablets and eReaders.
