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Backplanes and Patchpanels

High density backplane connector family available from TTI

High density backplane connector family available from TTI

TTI, Inc has announced the Tyco Z-PACK TinMan Backplane Connector family, a cost-effective solution for customers searching for a high density, high performance backplane interconnect system. The Z-PACK TinMan connector design offers a fully protected right-angle receptacle for use on daughter cards where handling damage can be a concern when mating to a vertical male header.

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Molex Signs Amphenol as Second-Source for Backplane Interconnect Family

Molex Signs Amphenol as Second-Source for Backplane Interconnect Family

Molex and Amphenol TCS (ATCS) have signed a cross license / second-source licensing agreement that gives ATCS the right to manufacture, market and sell the I-Trac Backplane Connector System worldwide. Molex is pleased to announce this latest development in the Molex-ATCS relationship," said Martin Slark, Chief Executive Officer of Molex. "The technology behind our I-Trac design offers users unmatched versatility and performance. By partnering with ATCS we will be able to expand the availability of this leading technology throughout the industry."

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