Automotive
The modular Approach to Tire Pressure Monitoring Systems
Melexis publicly unveils its second generation solution for TPMS, which combines the MLX91801 Pressure Sensor and MLX72013 RF Transmitter. Further, this TPMS module can be associated to the MLX71122 Multi-Channel RF Receiver in order to build a complete highly integrated solution, compliant with existing Remote Keyless Entry (RKE) systems.
Renesas Electronics Announces High-Performance, High-Function System-on-Chip (SoC) for High-End Automotive Display Systems
Renesas Electronics announced the availability of the new automotive system-on-chip (SoC), the SH7769, for high-end automotive display systems (graphics cluster, multifunction graphics display) supporting advanced human machine interfaces (HMI).
Fujitsu and Autotalks Partner to Provide Vehicle-to-Vehicle Communication Processor
Fujitsu Semiconductor Europe and Autotalks have announced that they have reached an agreement to co-operate on Autotalks' communication processor, to be developed by Autotalks and manufactured by Fujitsu Semiconductor. The combined efforts of the two technology leaders will provide OEMs and Tier1s with the best vehicle-to-vehicle communication processor at the highest level of reliability
TI introduces 36-volt op amp for the automotive market
Texas Instruments Incorporated introduced an automotive-qualified 36-V, single-supply, low-noise op amp (operational amplifier) that can operate on supplies ranging from +2.7 V to +36 V. The OPA171-Q1 offers high-precision performance in a cost-effective, low-power device. In addition to industry-standard packaging, the device is available for automotive qualification in the SOT-553 micro package, which is 50-percent smaller than comparable devices available today, and can reduce board space for automotive applications including HEV/EV, tracking amplifiers in power modules, and transducer amplifiers.
Mercedes-Benz Adopts MOST® Network Technology in Latest M-Class SUV
SMSC will showcase latest automotive network technology solutions at Electronic Systems for Vehicles VDI Congress on October 12-13, 2011 in Baden-Baden, Germany. You are invited to visit SMSC at booth 43. We are looking forward to meeting you in Baden-Baden!
Atmel Launches Industry's First LIN Transceivers in DFN Packages to Enable Smaller Footprint
Atmel Corporation has announced the availability of two stand-alone LIN (local interconnect network) transceiver ICs in DFN packages. Compared to standard SO8 packages at 5mm x 6.5mm, the DFN14 package for the ATA6670 measures at 3mm x 4.5mm, while the DFN8 package for the ATA6663 measures at 3mm x 3mm, saving about 75 percent of the overall PCB area. Space and cost savings are critical for LIN bus networking applications such as automotive body electronic systems, including door modules, seat control, intelligent sensors or powertrain applications. Since both DFN packages are pin-compatible, customers can use either the single- or the dual-LIN transceiver on the same PCB design without any changes.
Fail-safe Imems Gyroscope Provides Unmatched Shock And Vibration Immunity For Automotive Applications
Analog Devices' ADXRS800 patented* quad beam architecture provides 0.03°/sec/g of linear acceleration rejection while continuously monitoring the total electro-mechanical gyro performance. For automotive electronic stability control, rollover detection, and pitch detection applications, Analog Devices, Inc has introduced the ADXRS800 iMEMS gyroscope, featuring a patented differential quad-beam architecture designed to minimize the influence of linear shock and vibration. Qualified for automotive safety applications, the ADXRS800 is the most stable, vibration-immune automotive-grade gyro available while a continuous electro-mechanical self-test feature ensures the integrity of the gyro output signal.
ACROSSER launches four Vehicle grade LCD touch Monitor for In-Vehicle Application.
In the fast paced world of transportation services, touch monitor where display information is vital for coordinating field operation. The leading designer and manufacturer of In-Vehicle Computer manufacturer ACROSSER, launches its four Industrial grade LCD touch monitors for In-Vehicle Application that greatly enhance its product line.
Robust output module for harsh environments
Jetter AG, the system provider for mobile automation, is launching its JXM-IO-E09 local output module, specially developed for use in vehicles and mobile working machinery. It can be operated at a voltage of 8 – 32 VDC and at a temperature of -40 to +85 °C.
ALPS Offers TDGA6 Series of Compact HD RadioTuner Modules for Automotive Applications
ALPS ELECTRIC EUROPE GmbH offers with the TDGA6 series compact HD Radio tuner modules for automotive applications that have been pre-certified by the US-based iBiquity Digital Corporation for worldwide use with its HD Radio technology.
Volkswagen to Use Infineon Sensor Chip in Electric Power Steering Systems
Infineon Technologies AG today announced that in future the Volkswagen AG Business Unit Braunschweig will use Infineon's Hall sensors in electric power steering systems for vehicles. Infineon's TLE4998C4 programmable linear Hall sensor will be used for various model ranges. Infineon has already started to deliver the chips.
Littelfuse Introduces MLA Automotive Series Varistors for Transient Voltage Surge Suppression
Littelfuse, Inc. today introduced its new MLA Automotive Series varistors for transient voltage protection of integrated circuits and other board-level components in automotive applications. The new varistors have a wide operation voltage compared to Littelfuse existing AUML Series, making them suitable for numerous applications on power supply, control and signal lines. In addition, the series includes low capacitance models not available from some manufacturers.
Allegro MicroSystems, Inc. Introduces a New Family of Two-Wire, Hall-Effect Unipolar Switches Improved High Voltage Transient Protection
Allegro MicroSystems introduced a new line of two-wire, unipolar, Hall-effect switches to complement its existing family of devices used in seat belt buckle, seat position, and steering lock applications. These new devices are targeted to serve the automotive market, because they include improved high voltage transient protection, which is a feature that is critical for applications, which do not allow protection circuits to be located close to the sensor.
Wind River Collaborates with Magneti Marelli in Delivering First-of-Its-Kind GENIVI In-Vehicle Infotainment Solution for Automotive Industry
Wind River and Magneti Marelli today announced a technological collaboration to create the first GENIVI-compliant in-vehicle infotainment (IVI) solution for the automotive industry.
Infineon to Establish New Entity in China Meeting the Growing Demand for Energy Efficiency and Electromobility Solutions
Infineon Technologies AG today opened a new facility in China called Infineon Integrated Circuits (Beijing) Co., Ltd., located in the Beijing Economic and Technological Development Area. In addition to sales and marketing, application R&D and central functions, the new entity houses an IGBT stack manufacturing facility and a technical center for automotive solutions. IGBTs (Insulated Gate Bipolar Transistors) are power semiconductors used to drive electric motors both in automotive applications and in trains. Motor speed and torque can be regulated along a gradual scale. They also play an important role in the use of renewable energies: here IGBTs enable the efficient conversion of variable frequency output such as from a wind turbine or solar plant to a fixed frequency appropriate for the grid in the region concerned.
Sliding-Head Lathe Reliability And Back-Up Are Paramount
In a profitable turned parts manufacturing business, the most important thing is to keep the spindles running. This in turn means that lathes must have a high level of reliability and when a problem does occur, the machine supplier's response must be rapid and effective. Martin Lane, Managing Director of Wilco Manufacturing, Birmingham, says that this is exactly what he gets from Star GB.
Autotech celebrates significant order from Jaguar Land Rover
Autotech has been awarded a major contract for Jaguar Land Rover, supplying control systems to one of the car maker's plants in the West Midlands.
Software from ANSYS Revs up Performance at Red Bull Racing
Red Bull Racing Formula One in Europe has won this year's 2010 Formula One Constructors' Championship — assisted by race car improvements engineered using simulation software from ANSYS
Two-wire Hall-effect unipolar switches offer improved high-voltage transient protection for automotive applications
The A1152/3/5/6 from Allegro MicroSystems Europe are a range of two-wire unipolar Hall-effect switches designed for automotive sensing applications in seat-belt buckle, seat position, and steering lock applications. The new devices are produced using the Allegro advanced BiCMOS wafer fabrication process, and include improved high-voltage transient protection: a critical factor for automotive applications where external protection circuitry cannot be located close to the sensor.
TeleNav and QNX Team to Demonstrate Navigation and Search
TeleNav and QNX Software Systems Co. today announced that QNX and TeleNav have partnered to enable connected GPS navigation to work with the QNX CAR Application Platform. Automakers and Tier One suppliers using the QNX CAR Application Platform will soon have the ability to offer connected navigation and search, providing drivers with 3D turn-by-turn navigation and voice/audio prompts, along with real-time information like up-to-date maps, business listings, local places, traffic information, gas prices and more. QNX and TeleNav will demonstrate connected navigation and search in the QNX CAR Application Platform this week at the Consumer Electronics Show (CES) in Las Vegas, NV.
QNX Redefines the Mobile Office with First In-Car Email Integration with Bluetooth Smartphones at CES
QNX Software Systems Co., the global leader in operating systems and middleware for the in-car telematics and infotainment market, announced it will demonstrate the world's first in-vehicle mobile office integration of Bluetooth®-enabled smartphones in the sleek BMW Z4 Roadster at the Consumer Electronics Show (CES). The new system is designed to make it possible for drivers to use smartphones safely and conveniently while in their cars.
QNX Provides Software Platform for New Toyota Entune Multimedia System
System leverages mobile phones to create a rich in-vehicle experience that delivers integrated navigation, entertainment, and information services
NXP - First All-in-One Digital One-Chip for Automotive Radio Digital
Today NXP Semiconductors announced the industry's first RFCMOS-based, all-in-one digital chip for automotive radio applications. The TEF663x integrates AM/FM radio and audio signal post-processing functions in a single integrated circuit (IC). Until now, the tuner, radio DSP and audio post-processing DSP cores were separate ICs.
Murata increases rated current and reduces footprint of automotive grade common mode choke coils
Murata has introduced an SMD version of its high rated current common mode choke coil family, raising the rated current from 3A to 10A while reducing their footprint by approximately half. Dimensions of the new components are 13.4mm (maximum) x 8.9mm x 6.6mm (typical).
Infineon - Microcontrollers for Automotive M2M Systems; SLI 76 Family Is Industry’s First to Address the Stringent Automotive Quality Standards
Infineon Technologies announced its new SLI 76 "in Car" family of microcontrollers for the use in automotive Machine-to-Machine (M2M) systems. They are the industry's first UICC (Universal Integrated Circuit Card) microcontrollers that are qualified by the stringent processes of the Automotive Electronics Council (AEC) Q100 quality standard. The SLI 76 "in Car" chips offer long lifetime, high data retention, extended temperature range, and cycle endurance.
Pan-European eCall Trial of NXP and Partners Concludes in Brussels
This week sees the successful conclusion of a field trial designed to prove that the European emergency call system 'eCall' for vehicles is ready for mass deployment across Europe. The trial, which was initiated by NXP Semiconductors N.V., involved major industry players including BMW, IBM, Allianz OrtungsServices, Deutsche Telekom, Dekra, and European automobile clubs such as Touring, ANBW, AvD, and UAMK. Three cars equipped with NXP's telematics solution ATOP (Automotive Telematics On-Board Unit Platform) drove a total of 16,000 kilometers through sixteen different EU countries. During a two-week period, the telematics boxes sent out 15,000 eCalls via the mobile networks of Deutsche Telekom and its roaming partners; the eCalls were received and processed by IBM, Allianz OrtungsServices, and BMW servers or call centers.
Altium seeks to accelerate activity in European automotive sector
Altium has announced a new key role within its EMEA team to accelerate its activity in the European automotive sector. Michael Schua has been appointed Business Development Manager Automotive.
MEMS rate sensor from Murata features stable thermal performance and high reliability for accurate dead-reckoning
Murata has launched a MEMS rate sensor (gyro) which features excellent performance characteristics for the automotive market. The device, part number MEV-50C-R, supports accurate dead-reckoning performance for car navigation devices, but is also aimed at GPS modules, satellite antennas and other applications such as toys, including for example a high performance radio control helicopter. This sensor features the second-generation of Murata's technology - the first generation was used in Murata's famous bicycle-riding robot, MURATA BOY, and Murata's unicycle-riding robot, MURATA GIRL.
SYSGO & OpenSynergy join forces for the automotive market
SYSGO AG and OpenSynergy GmbH, two German software companies, have signed an exclusive cooperation agreement targeting the automotive market. They will join forces to provide carmakers with a software platform that already meets both avionics safety standards and AUTOSAR (Automotive Open System Architecture) requirements. Rolf Morich, general manager at OpenSynergy, said in a joint press release, "The high quality standards of SYSGO's technology enable us to provide a universal operating system for carmakers and their suppliers, one that bridges the gap between car and consumer electronics while meeting the high safety standards of the avionics industry."
Toshiba unveils 130nm BiCD for next-generation automotive-rugged integration
Toshiba Electronics Europe has revealed details of its new BiCD process, which combines 130nm logic design rule with current-handling capability to permit unprecedented integration in devices such as sensorless BLDC motor drives. The process is able to guarantee full specification over a wide temperature range, as well as high ESD robustness, providing a platform for a variety of industrial and automotive IC projects.
STMicroelectronics Announces Accelerometers for Automotive Airbags
STMicroelectronics (NYSE: STM), a leader in automotive ICs and in MEMS (Micro-Electro-Mechanical Systems) sensors, has introduced a new family of high-g acceleration sensors for advanced airbag systems. These micro-machined devices detect the rapid deceleration of the vehicle during a crash and send instant information to the airbag control unit.
MEMS Accelerometer from STMicroelectronics Monitors and Tracks Motion and Tilt around the Car
STMicroelectronics has expanded its sensor portfolio with a new automotive-grade 3-axis low-g accelerometer. Combining low power consumption and small footprint with high precision and robust performance, ST's new accelerometer targets a wide range of automotive applications, including vehicle tracking, event recording, abuse monitoring, and dead-reckoning for enhanced navigation capabilities.
OmniVision and Xilinx Develop Automotive Reference Design for 360-degree Surround View Applications
OmniVision Technologies, Inc. today announced that its OV9715 automotive-grade megapixel sensor has been selected by Xilinx, Inc. for its four camera, 360-degree surround view automotive reference design. The Xilinx reference design highlights the advantages of megapixel resolution sensors over VGA-based systems for extreme wide-angle field of view applications, such as greatly improved image distortion correction and stitching. Designed to meet the stringent requirements of the automotive and sensing applications markets, the OV9715 also improves on obstacle and pedestrian detection by capturing more detailed scene information.
NXP to develop cutting-edge automotive-qualified 3.5G telematics solution to improve traffic management in Singapore
NXP Semiconductors N.V. today announced that it is developing a cutting-edge automotive-qualified 3.5G telematics solution to improve traffic management, which can help address the challenge of traffic congestion in Singapore. Expected to be deployed in 2012, NXP will develop innovative technologies based on NXP's next-generation Automotive Telematics On-board Platform (ATOP). Singapore will be a test bed for ATOP, leveraging the city's world-class infrastructure to deliver real-time information via mobile broadband and help reduce traffic congestion.
ST at ITS 2010: Silicon Solutions for Safer and Smarter Cars
A top-three automotive semiconductor vendor, STMicroelectronics will demonstrate its latest innovations for car safety, navigation and infotainment at the 17th ITS World Congress held in Busan, Korea, on October 26-29, 2010. ITS is the world's largest exhibition and conference on intelligent transport systems and services. ST supplies chips to all major automotive manufacturers and its portfolio of automotive solutions covers all key application areas in the car. The Company combines an unparalleled platform of advanced technologies with a thorough understanding of the automotive market that it has gained through close collaboration with leading customers and an unswerving commitment to quality.
Fujitsu - Graphics Controller for Hybrid & Re-configurable Dashboards and Car Navigation
Fujitsu Semiconductor Europe announces the development of MB86R11, a single chip enabling the development of next-generation automotive display systems of hybrid and re-configurable dashboards as well as car navigation and assistance systems.
Freescale chips drive next-generation automotive body electronics applications
As drivers opt for more comfort and convenience features in their cars, automotive body electronics will continue to require more complex semiconductors while maintaining competitive price points. Freescale Semiconductor is expanding its popular line of 16-bit S12 microcontrollers (MCUs) optimised for a broad range of cost-sensitive automotive body electronics applications. The advanced S12G devices are designed to accommodate application requirements, with flexibility in memory, package and cost options.
Freescale reveals new integrated technology for intelligent networking applications in automobiles
Freescale Semiconductor is introducing its next-generation technology to serve the fast-growing automotive intelligent distributed nodes market. Freescale's new integrated LL18UHV technology, along with existing S12 microcontroller (MCU) system-in-package (SiP) product families, meet the technical and commercial demands of applications in which space requirements and cost need to be minimised, such as window-lifts, sunroofs and motor control.
Freescale accelerates automotive safety with advanced airbag sensors
The development of safer vehicles is a key technology driver for the automotive industry, with airbag safety systems leading the charge. The U.S. National Highway Traffic Safety Administration (NHTSA) estimates that frontal air bags alone saved more than 25,780 lives between 1987 and 2008. As automotive suppliers continue to incorporate critical safety features in their designs, they must continue improving performance, while at the same time reducing cost to gain a competitive edge.
New MOST Generation MOST150 to Be Integrated in Audi A3 Vehicles First
The MOST Cooperation is proud to announce that its core partner members Audi and Daimler will be the first carmakers to integrate MOST150 into series production vehicles. Since the first implementation of MOST25 in an Audi car in 2002, MOST has become the established standard for the networking of premium infotainment systems at Audi, stated Jens Koetz, Director of the division of electrical/electronic design, networking, energy systems, and system safety at AUDI AG. Now the new generation MOST150 offers unique advantages as a speed upgrade through consistent further development of the existing transmission technology. Infotainment applications place very different demands on the network infrastructure, and MOST150 provides all the communication mechanisms over one interface, an all-in-one approach.
